Method for captivating a substrate within a holder

A method of captivating a quartz crystal device within a holder for photolithographic processing comprising the steps of:

• placing a quartz crystal having two opposed major surfaces, at least one of said surfaces being uniformly plated with aluminum, within a holder having two opposed major surfaces, said holder having at least one aperture appropriately dimensioned for accepting said crystal;
• laminating a dry film photopolymer resist to at least one surface of said holder and at least one aluminum plated surface of said quartz crystal, thereby captivating said quartz crystal within the aperture of said holder;
• exposing said resist to light passed through a photolithographic mask causing polymerization in desired areas including at least one uninterrupted area extending from the surface of said holder to the surface of said quartz crystal;
• removing unpolymerized resist, thereby leaving retaining tabs in at least one uninterrupted area extending from the surface of said holder to the surface of said quartz crystal,
• etching away said aluminum from areas exposed by removing unpolymerized resist.

A method of captivating a quartz crystal within a holder for photolithographic processing comprising the steps of:

• providing a quartz crystal having two opposed major surfaces, said surfaces being uniformly aluminum plated;
• providing a stainless steel holder having two opposed major surfaces and drive holes spaced at regular intervals along the length of said holder near its edges rendering said holder compatible with 35 MM photographic film drive equipment, said holder having a plurality of apertures appropriately dimensioned for accepting said crystal;
• placing said quartz crystal within the aperture of said holder forming a first assembly having two opposed major surfaces;
• heat laminating a dry film photopolymer resist to both surfaces of said first assembly by passing said first assembly with resist on each surface between heated rollers to form a second assembly,
• sandwiching said second assembly between and substantially in contact with two photolithograph glass masks,
• polymerizing desired areas of said resist on both surfaces simultaneously by passing ultra-violet light through said masks including at least one uninterrupted area extending from the surface of said holder to the surface of said crystal,
• passing said second assembly through a developing agent suitable for removing unpolymerized resist,
• passing said second assembly through a solution suitable for etching aluminum,
• removing said crystal from said holder,
• dissolving polymerized resist using acetone.

A method of captivating a substrate within a holder for photolithographic processing comprising the steps of:

• placing a substrate having two opposed major surfaces within a holder, said holder having two opposed major surfaces and at least one aperture appropriately dimensioned for accepting said substrate;
• laminating a dry film photopolymer resist to at least one surface of said holder and said substrate, thereby captivating said substrate within the aperture of said holder;
• polymerizing said resist in a manner which allows removal of resist in certain areas while leaving at least one uninterrupted area extending from one surface of said holder to a corresponding surface of said substrate;
• and
• removing resist in certain areas, thereby leaving a retaining tab of resist in at least one uninterrupted area extending from one surface of said holder to one surface of said substrate.