Method of vacuum depositing a layer on a plastic film substrate
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKoichi Shinohara, Takashi Fujita
Life of this patent
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Abstract
A method of vacuum depositing a layer on a plastic film in which the film is transported so as to pass along a metal surface moving with the film, which surface removes heat from the film, and vacuum depositing the vapor of an evaporant onto the surface of the plastic film while it is in contact with the metal surface. The film is in an electret state when it is located at the metal surface, whereby an electrostatic attractive force is produced between the film and the metal surface, thereby increasing the efficiency of heat conduction between the film and the metal.
Claims5
A method of vacuum depositing a layer on a plastic film prior to winding the film comprising the steps of:
- transporting the film along a metal surface which is movable with the film, said metal surface being grounded and which metal serves to control the temperature of the film in contact therewith by conducting heat away from said film;
- rendering said film in an electret state with a surface potential higher than 150 V, prior to or at the same time as the film contacts the metal surface, whereby said film is electrostatically attracted to said metal surface, thereby increasing the efficiency of the heat conduction between the film and the metal surface;
- depositing a material on the portion of said film which is opposite the portion in contact with said metal surface;
- and
- neutralizing the surface potential of said film so as to render it into a non-electret state after said deposition step and prior to winding the film.
Dependencies are inferred from the claim text.