US 4,392,290 A · Apparatus separating hybrid substrate

Abstract

Stacked leaded hybrid substrates and associated carrier plates are exited from a reflow solder operation into a vibrating table. Vibration of the table sequentially advances each stacked carrier and substrate until components on the latter contact an arm that is spaced above the table. Detection of the presence of a substrate and carrier adjacent the arm causes a plunger to move transversely across the table and into contact with an edge of the substrate. Further movement of the plunger pushes an edge of the carrier into contact with spring loaded pins in the table top. The shear force created on contiguous surfaces of the substrate and carrier by the plunger and pins causes the substrate to slide off of the carrier and over the pins. If this shear force exceeds a prescribed value, the pins rotate into the table top for passing a carrier and/or substrate without damaging the latter. In an alternate embodiment, separation is accomplished with a rotating brush that moves only substrates stacked on a carrier plate over an elongated bar on the table top.

Claims8

Dependent claims

Apparatus for separating a leaded hybrid substrate from a heat conductive carrier plate that it is sitting on, the flat bottom of the substrate being contiguous with and stuck to the flat top surface of the plate by semi-liquid solder flux following a reflow solder operation, comprising:

a work table having a flat top, the flat bottom of the plate resting on the flat table top;
a stop member in a fixed position on the table top and projecting a prescribed distance above it that is less than the thickness of the plate;
first means for producing a first force in one direction in a plane that is generally parallel to the table top and positioned above the latter for being applied to a non-leaded edge of the substrate that is adjacent to a leaded side thereof rather than to the edge of a plate of a stacked pair thereof, the first force exerted on the edge of a substrate moving the plate of a stacked pair thereof against said stop member for restricting movement of the plate in the one direction so as to enable separation of the substrate and plate along the broad contacting surfaces thereof;
and
second means for releasing said stop member for allowing continued movement of the plate, or a flat part resting on the table top in the position of the plate, in the one direction when the force exerted on or translated to the plate or part by said first means and stop member exceeds a prescribed value.

2 more elements

Apparatus for separating a leaded hybrid substrate having leads on a side thereof from a heat conductive carrier plate that it is sitting on, the substrate having a flat bottom that is contiguous with and stuck to the flat top surface of the plate by solder flux following a reflow solder operation, comprising:

a work table having a flat top, the flat bottom of the plate of a stacked substrate and plate resting on the flat table top with leads facing in one of a first direction and a direction opposite thereto;
first means for causing movement of the stacked substrate and plate in the first direction along a first path on the table top;
second means limiting movement of the plate of a stacked substrate and plate in a second direction that is generally transverse to the first direction;
third means producing a force, in the second direction in a plane generally parallel to the table top and positioned above the latter, only on a non-leaded edge of a substrate (that is stacked on a plate) for initiating movement of it and the associated plate in the second direction;
and second means limiting movement of the plate in the second direction for creating a shear force along the contiguous surfaces of the substrate and plate that is normally sufficient to separate them for allowing continued movement of only the substrate in the second direction and beyond the limited position of the second plate.

2 more elements

Dependencies are inferred from the claim text.

Apparatus separating hybrid substrate

Life of this patent

Apparatus separating hybrid substrate

Life of this patent

Abstract

Claims8