Integrated circuit package
AssigneeInternational Business Machines Corporation
InventorsRonald W. Gedney, John Rasile
Life of this patent
Estimating the term…
Abstract
A prepunched copper/dielectric laminate ground plane assembly is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection between the ground plane and the circuit connection pins is achieved by welding or soldering of bonding elements between selected pins, which also provides mechanical attachment of the ground plane to the substrate.
Claims5
A metallized ceramic package for high speed circuitry including
- a ceramic substrate,
- metallic circuit lines on said substrate,
- an integrated circuit chip positioned on said substrate and connected to said circuit lines,
- a plurality of connection pins passing through said ceramic substrate, each pin having a connection to one of said circuit lines,
- a ground plane of conducting material positioned on top of said substrate, said ground plane having holes therein over said connections and over said integrated circuit chip whereby said ground plane can be in close proximity to a substantial portion of said substrate, and
- a layer of insulating material between said ground plane and said circuit lines.
The method of providing an improved ground plane for a metallized ceramic package for high speed circuitry in which a ceramic substrate has metallized circuit lines thereon, and has an integrated circuit chip positioned on said substrate and connected to said circuit lines, and further has a plurality of connector pins passing through said ceramic substrates, each of said pins being a connection to one of said circuit lines, comprising the steps of:
- laminating a sheet of conductive material and dielectric material to form a laminated ground plane assembly,
- punching said ground plane assembly to provide clearance openings for said chip and said pins,
- positioning said ground plane assembly and said substrate so as to clear said chip and said pins, and
- bonding said conductive material to at least one of said pins, at at least two different locations.
Dependencies are inferred from the claim text.