Apparatus for cutting and forming the flexible beam leads made of a ductile metal of an integrated circuit chip having four sides, four groups of leads with each group of leads projecting normally from a different side of a chip, the chip being attached by its leads to a segment of a strip of film, the segment having a pair of reference sprocket holes and a window, with the inner portion of the leads bonded to the chip extending over the window and with the chip positioned in the window;
- comprising:
- a punch press, said press having a base plate and a top plate, means for mounting the top plate for substantially vertical reciprocal linear motion with respect to the base plate between a first position in which the top plate is spaced at a maximum distance from the base plate and a second position in which the top plate is placed at a minimum distance from the base plate;
- means for causing the top plate to move from its first position to its second position and then to return to its first position;
- die wall means, said die wall means having an upper planar surface and inner surfaces substantially perpendicular to the upper planar surface, the inner surfaces of the die wall means forming a die recess, the intersections of the upper surface and the inner surfaces of the die wall means defining continuous die cutting edges, said die cutting edges lying in a die cutting plane,
- means for removably mounting the die wall means on the base plate;
- a forming block removably mounted in the die recess, said forming block having an upper surface and outer surfaces, continuous forming edges positioned substantially at the intersections of the outer surfaces and the upper surface of the forming block, the outer surfaces of the forming block being spaced a predetermined distance from the inner surfaces of the die wall means to form a punch receiving space, the upper surface of the forming block substantially lying in the die cutting plane, a recess formed in the upper surface of the forming die adapted to receive an integrated circuit chip whose leads are to be cut and formed;
- a punch holder removably secured to the top plate of the punch press;
- punch wall means, said punch wall means having a bottom planar surface, inner surfaces, and outer surfaces, the inner and outer surfaces being normal to the bottom surface, the inner surface of the wall means forming a punch space, the intersections of the bottom surface of the punch wall means and the outer surfaces of the punch wall means forming continuous punch cutting edges, said punch cutting edges substantially lying in a punch cutting plane, and continuous punch forming edges positioned substantially at the intersections of the inner surfaces of the punch wall means and the bottom surface;
- means for removably mounting said punch wall means on the punch holder so that the punch cutting plane is substantially parallel to the die cutting plane;
- so that the punch cutting edges are in shearing relationship with the die cutting edges, and so that the punch forming edges are in forming relationship with the forming edges of the forming block as the top plate of the punch press moves from its first position to its second position;
- a pressure pad made of a resilient material mounted for reciprocal motion in the punch space;
- means for resiliently biasing the pressure pad toward the die wall means;
- die alignment bores formed in the die holder;
- punch alignment bores formed in the punch holder;
- a film alignment pin mounted in each punch alignment bore for reciprocal motion therein;
- a pin lifter;
- means mounted on the top plate having a rod connected to the pin lifter for moving the alignment pins from a position in which they project below the punch cutting plane sufficiently to enter into the die alignment bores of the die holder and to withdraw the film alignment pins so that they are above the punch cutting plane of the punch, said alignment pins adapted to enter the reference sprocket holes of a film segment placed between the punch wall means and the die wall means with the integrated circuit chip positioned in the recess in the forming block to accurately position the chip and its leads with respect to the die cutting edges with the flexible leads of the four groups of leads attached to the chip in contact with the upper surface of the forming block and the upper surface of the die wall means, said pressure pad engaging and clamping the flexible leads to the upper surface of the forming block prior to the punch and die cutting edges severing all of the leads and the forming edges of the punch wall means and forming block bending all of them.