Silicon wafer polishing
AssigneeInternational Business Machines Corporation
InventorJagtar S. Basi
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Abstract
The polishing of monocrystalline silicon wafers with an aqueous composition of fine sized abrasive particles, a soluble alkali metal base such a sodium carbonate and an oxidizing agent such as sodium or potassium salt of dichloroisocyanuric acid (e.g., salts of halo-trizenetrione).
Claims16
A reagent composition for polishing substrates comprising an aqueous mixture of silicon dioxide particles in a size range of about 5 to about 200 millimicrons, a soluble alkali metal base and an oxidizing agent selected from the group consisting of sodium and potassium salts of dihaloisocyanuric acid, wherein the ratio of said base to said oxidizing agent is in the range of about 05:1 to about 3.2:1, and with the ratio of silicon particles to said base in the range of about 8.5:1 to about 55.6:1.
Dependencies are inferred from the claim text.