US 3,937,579 A · Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate

Abstract

The invention concerns a process for the two-sided exposure of a semiconductor or substrate plate, especially exposure of a wafer, through exposure masks which are arranged in plane parallel, parallel and rotational alignment to either side of a semiconductor plate. The invention further concerns an apparatus for parallel and rotational alignment to either side of a semiconductor plate. The invention further concerns an apparatus for parallel and rotational alignment of a semiconductor or substrate plate, especially alignment of a wafer, in relation to two exposure masks, operating on either of the two surfaces of the semiconductor or substrate plate, for the purpose of a two-sided exposure, in accord with the process established by the invention. An adjustable wedge-error correction head is provided supporting the semiconductor or substrate plate, for plane parallel adjustment of one surface, preferably the top one, of the semiconductor or substrate plate relative to the first exposure mask, also preferably the upper one, and an apparatus for bringing into contact the other surface of the semiconductor or substrate plate, preferably the lower one, relative to the second exposure mask, also preferably the lower one. A rotational compound slide table is provided, arranged in a plane parallel to the first exposure mask and displaying a mask mounting support for same, for the plane parallel position calibration of the first exposure mask relative to the semiconductor or substrate plate and to a microscope-type viewing device.

Claims10

Dependent claims

Process for the simultaneous double-sided exposure of a substrate plate, such as a semiconductor wafer, bearing a pre-disposed pattern on at least one surface through first and second exposure masks arranged in plane parallel, parallel and rotational alignment with each of said exposure masks being coordinated and in registry with one predetermined side of a wafer to be treated, characterized by the steps of:

a. bringing the two exposure masks into contact in mutual plane-parallel alignment and thereafter aligning said masks into mutual plane parallel and plane rotational alignment;
b. moving said masks relatively away from each other along an axis normal to the planes thereof, while retaining said mutual plane parallel and plane rotational alignments;
c. forcing said substrate into plane-parallel air cushion free contact and into registry with a first of the two exposure masks ad fixing said plane-parallel alignment while maintaining said mutual plane parallel and plane rotational alignment between said masks;
d. separating said wafer from said first exposure mask by a predetermined distance and performing a parallel and rotational alignment and registration of said wafer with respect to both exposure masks;
e. moving said second exposure mask toward an opposed surface of said wafer while retaining the registry mutual plane parallel and mutual plane rotational alignments between said exposure masks with respect to each other and with respect to said wafer;
and
f. simultaneously exposing said wafer through said first and second exposure masks.

4 more elements

Apparatus for parallel and rotational alignment of a substrate plate such as a semiconductor wafer, or the like, relative to first and second exposure masks adapted to be effective to one to either of the two opposed major surfaces of the wafer, for the purpose of double-sided exposure thereof, and comprising:

a. means for establishing an exposure beam path for said opposed surfaces of a wafer held by said apparatus;
b. an adjustable wedge-error correction head for supporting the wafer for plane parallel adjustment of one major surface of the wafer relative to the first of said exposure masks;
c. apparatus for moving the opposed surface of said wafer into contact with said second exposure mask;
d. first support means for arranging and supporting said first exposure mask and including a rotational compound slide table, and having means for the plane parallel position calibration of said first exposure mask relative to one major surface of said wafer relative to a microscopic viewing device;
e. a microscopic viewing device in viewing relationship with an exposure mask supported in said first support means;
f. an auxiliary rotational compound slide table having a second mask support means for receiving the second of said exposure masks;
and
g. means coupling the drive slide of said first rotational compound slide table to the drive slide of said auxiliary rotational compound slide table, the arrangement being such that:
1. the first mask support means is connected to its associated rotational compound slide table through a support approachment guide means extending normal to the plane of travel of the first and second compound slide tables;
2. one of said mask supports being constructed as an adjustable wedge-error calibration frame in one of said compound slide tables;
said wedge-error correction head being arranged to receive said wafer and being bearingly mounted to a swivel arm, with said swivel arm being pivotable in a rotational plane lying generally parallel to and intermediate the planes of displacement of said two rotational compound slide tables, said swivel arm being pivotally movable along an axis perpendicular to the planes of displacement of said first and second mask support means;
3. means on said swivel arm for moving said swivel arm together with a wafer disposed thereon toward the surface of a selected one of said exposure masks until contact is achieved between the surface of said wafer and the surface of said selected exposure mask;
and
4. means on said swivel arm for releasably retaining said wafer for carrying said wafer to and from contact with said selected exposure mask.

11 more elements

Apparatus for parallel and rotational alignment of a substrate plate such as a semiconductor wafer, or the like, relative to first and second exposure masks adapted to be effective to one to either of the two opposed major surfaces of the water, for the purpose of double-sided exposure thereof, and comprising:

a. means for establishing an exposure beam path for said opposed surfaces of a wafer held by said apparatus;
b. an adjustable wedge-error correction head for supporting the wafer for plane parallel adjustment of one major surface of the wafer relative to the first of said exposure masks;
c. apparatus for moving the opposed surface of said wafer into contact with said second exposure mask;
d. support means for arranging and supporting said first and second exposure masks and including first and second rotational compound slide tables, each having means for the plane parallel position calibration of said first and second exposure masks relative to one major surface of each of said wafers relative to a microscopic viewing device;
e. a microscopic viewing device in viewing relationship with an exposure mask supported in each of said first and second support means;
and
f. means coupling the drive slide of said first rotational compound slide table to the drive slide of said second rotational compound slide table, the arrangement being such that:
1. said first and said seond mask support means being rigidly connected to their associated rotational compound slide tables and the drive slide of said first rotational compound slide table is connected with the drive slide of said second rotational compound slide table through a table approachment guide which extends generally perpendicularly to the point of travel of said two rotational compound slide tables;
2. one of said mask supports being constructed as an adjustable wedge-error calibration frame in one of said compound slide tables;
said wedge-error correction head being arranged to receive said wafer and being bearingly mounted to a swivel arm, with said swivel arm being pivotable in a rotational plane lying generally parallel to and intermediate the planes of displacement of said two rotational compound slide tables, said swivel arm being pivotally movable along an axis perpendicular to the planes of displacement of said first and second mask support means;
3. means on said swivel arm for moving said swivel arm together with a wafer disposed thereon toward the surface of a selected one of said exposure masks until contact is achieved between the surface of said wafer and the surface of said selected exposure mask;
and
4. means on said swivel arm for releasably retaining said wafer for carrying said wafer to and from contact with said selected exposure mask.

10 more elements

Dependencies are inferred from the claim text.

Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate

Life of this patent

Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate

Life of this patent

Abstract

Claims10