US 2026/0297808 A1 · APPARATUS AND METHOD OF FORMING A COLLOID CONTAINING LAYER

Abstract

A method and system for depositing diamond particles on semiconductor substrates includes delivering a cleaning solution to form a clean substrate surface, applying a first rinsing solution, and delivering a colloidal solution containing diamond particles while applying sonic energy. The sonic energy is provided by a transducer to prevent particle agglomeration and ensure uniform distribution across the substrate surface. The method includes delivering a second rinsing solution to remove excess colloidal material followed by heating the substrate to promote adhesion of the diamond particles through Van der Waals forces. Various embodiments include delivering the colloidal solution through immersion, aerosol jet spray nozzles, or through nozzles with integrated sonic capabilities. The process may be performed in integrated processing systems with multiple chambers for cleaning, deposition, and heating operations, providing an automated manufacturing solution for creating uniform diamond seed layers used in thermal management applications for microelectronic devices.

Claims20

Dependent claims

A method of forming a layer, comprising:

delivering a cleaning solution to a surface of a substrate;
delivering a first rinsing solution to the surface of the substrate to form a rinsed surface of the substrate;
delivering a colloidal containing solution to the rinsed surface of the substrate, wherein delivering a colloidal containing solution comprises delivering, by a transducer, sonic waves to the colloidal containing solution while the colloidal containing solution is delivered to the rinsed surface to form a colloidal material containing layer;
delivering a second rinsing solution to the colloidal material containing layer formed on the surface of the substrate;
and
heating the colloidal material containing layer and the substrate to a first processing temperature.

3 more elements

A method of depositing a layer, comprising:

delivering, in a first processing chamber of a processing system, a cleaning solution to a surface of a substrate to form a clean surface on the substrate;
delivering, in the first processing chamber, a first rinsing solution to the clean surface of the substrate;
transferring the substrate from the first processing chamber to a second processing chamber disposed within the processing system;
delivering, in the second processing chamber, a colloidal containing solution to the surface of the substrate to form a colloidal material containing layer on the surface, wherein delivering the colloidal containing solution comprises delivering sonic waves to the colloidal containing solution while the colloidal containing solution is delivered to the surface;
delivering, in the second processing chamber, a second rinsing solution to the surface of the substrate that includes the colloidal material containing layer;
transferring the substrate from the second processing chamber to a third processing chamber disposed within the processing system;
and
heating, in the third processing chamber of the processing system, the colloidal material containing layer and substrate to a first processing temperature.

5 more elements

Dependencies are inferred from the claim text.

Apparatus and method of forming a colloid containing layer

Life of this patent

Apparatus and method of forming a colloid containing layer

Life of this patent

Abstract

Claims20