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US 2026/0297756 A1Published application
Process and apparatus to remove metal-containing films from a chamber
AssigneeApplied Materials, Inc.
InventorsKELVIN CHAN, RUIYING HAO
Life of this patent
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Abstract
Embodiments disclosed herein include methods for removing a metal containing layer from a chamber of a tool. In an embodiment, the method comprises generating a remote plasma in the tool. The method may continue with flowing reactive species from the remote plasma into the chamber, and flowing a hydrocarbon gas into the chamber. In an embodiment, the method may include reacting the reactive species with the hydrocarbon gas within the chamber. In an embodiment, the method may further comprise etching the metal-containing material in the chamber.
Claims12
A tool, comprising:
- a remote plasma source;
- a chamber coupled to the remote plasma source;
- and
- a dual channel showerhead between the remote plasma source and the chamber, wherein first channels are fluidically coupled to the remote plasma source, and wherein second channels are fluidically coupled to a gas source.
1 more element
An apparatus, comprising:
- a dual channel showerhead configured to be positioned between a remote plasma source and a chamber coupled to the remote plasma source, wherein first channels are configured to be fluidically coupled to the remote plasma source, and wherein second channels are configured to be fluidically coupled to a gas source.
Dependencies are inferred from the claim text.