Method of determining stressors applied to a substrate
AssigneeASML Netherlands B.V.
InventorsRonald Henricus Johannes OTTEN, Xiuhong WEI
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AssigneeASML Netherlands B.V.
InventorsRonald Henricus Johannes OTTEN, Xiuhong WEI
Estimating the term…
A method of determining the presence of stressors on a substrate. The method includes obtaining substrate position data describing positional information of structures on the substrate in a substrate plane; obtaining substrate shape data describing a shape of the substrate; determining a first warp value from the substrate position data, the first warp value describing a warpage of the substrate; determining a second warp value from the substrate shape data, the second warp value describing the warpage of the substrate; and determining the presence of stressors on a back-side of the substrate based on the first warp value and second warp value.
A method of determining the presence of stressors on a substrate, the method comprising:
A non-transitory computer-readable medium comprising stored program instructions configured, when run on a suitable apparatus, to cause the apparatus to at least:
Dependencies are inferred from the claim text.