Substrate processing apparatus

A substrate processing apparatus, comprising:

• an ultraviolet (UV) exposure apparatus configured to irradiate a reticle pod with a UV beam, the reticle pod comprising a reticle, a base configured to support the reticle, and a cover configured to cover the reticle on the base;
• and
• an extreme ultraviolet (EUV) exposure apparatus configured to perform an EUV exposure process on the reticle pod which had been irradiated with the UV beam by the UV exposure apparatus,
• wherein the UV exposure apparatus comprises,
• a cover storage configured to remove the cover of the reticle pod;
• a UV exposure chamber configured to house the reticle pod with the cover removed;
• a UV lamp on a bottom surface of the UV exposure chamber;
• a pivot spaced apart from the UV lamp in a first direction intersecting the bottom surface, and configured to rotate about a rotating axis in a direction intersecting the first direction;
• and
• a bracket connected to the pivot and configured to rotate about the rotating axis, the bracket contacting the reticle of the reticle pod,
• wherein the UV lamp is configured to irradiate a main surface of the reticle with the UV beam to remove an oxide layer on the main surface of the reticle.

A substrate processing apparatus configured to perform an exposure process on a reticle pod comprising a reticle, a base configured to support the reticle, and a cover configured to cover the reticle on the base, the substrate processing apparatus comprising:

• a load lock configured to receive the reticle pod which has been exposed to atmosphere and create a vacuum environment in the load lock after receiving the reticle pod;
• a mask inspection apparatus configured to perform optical inspection on the reticle of the reticle pod;
• an ultraviolet (UV) exposure apparatus configured to irradiate the reticle, on which the optical inspection has been performed, with a UV beam;
• an extreme ultraviolet (EUV) exposure apparatus configured to perform an EUV exposure process on the reticle which has been irradiated with the UV beam in the UV exposure apparatus;
• and
• a transfer robot configured to transfer the reticle pod between the load lock, the mask inspection apparatus, the UV exposure apparatus, and the EUV exposure apparatus,
• wherein the UV exposure apparatus comprises,
• a cover storage configured to remove the cover of the reticle pod received from the transfer robot;
• a UV exposure chamber configured to house the reticle pod with the cover removed;
• a supporting portion configured to support the reticle of the reticle pod in the UV exposure chamber;
• and
• a UV lamp spaced apart from the supporting portion in a first direction intersecting a bottom surface of the UV exposure chamber and aligned to face a main surface of the reticle,
• wherein the UV lamp is configured to irradiate the main surface of the reticle with the UV beam to remove an oxide layer on the main surface of the reticle, the reticle being supported by the supporting portion.