Cooling system for the liquid immersion cooling of electronic components

Abstract

A cooling system including liquid immersion cooling of electronic components, a container which can be filled with a two-phase heat transfer fluid and into which electronic components can be immersed in the liquid phase thereof. The container has a gas chamber over the surface of the liquid heat transfer fluid and a lid for closing the container in a fluid-tight manner. The lid or the container has a seal device, having a side which faces the gas chamber, a side which faces away from the gas chamber, and a seal which prevents the passage of a gaseous fluid and which has a seal surface. Furthermore, at least the side facing the gas chamber is configured to be continuous as a vapor barrier against the chemical effect of the fluid.

Dependencies are inferred from the claim text.