Plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers
AssigneeApplied Materials, Inc.
InventorsZhepeng CONG, Saurabh CHOPRA, Abhishek DUBE
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AssigneeApplied Materials, Inc.
InventorsZhepeng CONG, Saurabh CHOPRA, Abhishek DUBE
Estimating the term…
The present disclosure relates to plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume, a substrate support disposed in the internal volume, a plate apparatus disposed in the internal volume and at least partially defining a processing volume between the plate apparatus and the substrate support. The plate apparatus includes one or more flow openings formed in one or more plate walls. The processing chamber includes one or more absorptive masses disposed in the one or more flow openings.
A processing chamber, comprising:
A chamber kit, comprising:
A method of substrate processing, comprising:
Dependencies are inferred from the claim text.