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US 2026/0107799 A1Published application
Substrate structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChieh-Yi HSIEH, Jui-Kun WANG, Fang-Wei CHANG, Chih-Wen FAN, Hsiu-Fang CHIEN
Life of this patent
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Abstract
Provided is a substrate structure including a substrate body and a plurality of insulating blocks. The substrate body has a circuit layer and is defined with a chip placement area. The plurality of insulating blocks are disposed on the substrate body in the chip placement area and cover part of the circuit layer to reduce the ratio of the exposed circuit layers, thereby the delamination problem can be eliminated.
Claims10
A substrate structure, comprising:
- a substrate body having a circuit layer formed on a surface thereof, wherein the surface of the substrate body is defined with a chip placement area;
- and
- a plurality of insulating blocks formed on the surface of the substrate body and located in the chip placement area to cover a portion of the circuit layer.
Dependencies are inferred from the claim text.