Semiconductor element and manufacturing method thereof
AssigneeNational Cheng Kung University
InventorsWei-Chen TU, Yi-Hsiang SHIH
Life of this patent
Estimating the term…
Loading patent…
AssigneeNational Cheng Kung University
InventorsWei-Chen TU, Yi-Hsiang SHIH
Estimating the term…
A method for manufacturing a semiconductor element includes a preparation step, a protective gas introduction step, a reaction gas introduction step, and a deposition step. Firstly, a semiconductor sample is prepared on a stage of a cavity, where a line width of a circuit pattern layer of the semiconductor sample is less than 100 nm. Then, the stage is heated to and maintained at 250° C. to 480° C., and plasma is activated in a protective atmosphere to crack introduced benzene vapor to form a graphene layer on the circuit pattern layer, where a thickness of the graphene layer is 0.3 nm to 4.5 nm. The reaction can be carried out at a low temperature using the benzene vapor as a carbon source, improving properties of graphene deposited on a surface of the circuit pattern layer, and greatly reducing resistance of the circuit pattern layer.
A method for manufacturing a semiconductor element, comprising:
A semiconductor element, comprising:
Dependencies are inferred from the claim text.