Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus

A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:

• (a) providing a substrate including a first region, which forms an outer surface of a recess and is adjacent to an opening of the recess and whose surface is terminated by a first termination, and a second region, which forms an inner surface of the recess and whose surface is terminated by the first termination;
• and
• (b) removing the first termination in the first region by exposing the substrate to a first processing solution containing a liquid that reacts with the first termination, so that a density of the first termination in the first region is smaller than a density of the first termination in the second region.

A substrate processing apparatus, comprising:

• a first processing solution exposure system configured to expose a substrate to a first processing solution;
• and
• a controller configured to be capable of controlling the first processing solution exposure system so as to perform a process of exposing the substrate including a first region, which forms an outer surface of a recess and is adjacent to an opening of the recess and whose surface is terminated by a first termination, and a second region, which forms an inner surface of the recess and whose surface is terminated by the first termination, to the first processing solution containing a liquid that reacts with the first termination, to thereby remove the first termination in the first region, so that a density of the first termination in the first region is smaller than a density of the first termination in the second region.