Heat dissipation device and manufacturing method therefor

A manufacturing method for a heat dissipation device, comprising:

• forming a thermally-conductive base that includes a heat absorbing surface and a heat dissipation surface opposite to the heat absorbing surface, the heat absorbing surface being thermally coupled to a heat source, the thermally-conductive base including a plurality of accommodation holes that extend between the heat absorbing surface and the heat dissipation surface;
• disposing a plurality of heat pipes within the accommodation holes, respectively, each of the heat pipes including a first surface and a second surface that faces away from the first surface, wherein the heat absorbing surface includes a thermal contact region configured for direct thermal engagement with the heat source and a peripheral region extending from the thermal contact region, with the heat pipes distributed between the thermal contact region and the peripheral region in unequal numbers;
• performing a first mechanical processing procedure to squeeze the heat pipes to flatten the first surfaces of the heat pipes relative to a heat dissipation surface of the thermally-conductive base;
• and
• performing a second mechanical processing procedure to abrade the heat dissipation surface of the thermally-conductive base and the first surfaces of the heat pipes to make the first surfaces of the heat pipes and the heat dissipation surface of the thermally-conductive base directly connected to one another and substantially coplanar.