Photoresist coating method

A photoresist coating method, characterized in that:

• providing a wafer to maintain in a first rotation speed;
• spraying a photoresist on a surface of the wafer;
• performing a high rotation speed step to increase the rotation speed of the wafer to a second rotation speed, and moving part of the photoresist to an edge region on the wafer;
• performing a first wafer edge cleaning step on the edge region of the wafer after the above steps are performed;
• reducing the rotation speed of the wafer to a third rotation speed after the above steps are performed;
• and
• performing a second wafer edge cleaning step on the edge region of the wafer after the above steps are performed.