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US 2026/0096483 A1Published application
Scalable Capacity and Bandwidth Expansion for Memory Systems
AssigneeApple Inc.
InventorSanjay Dabral
Life of this patent
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Abstract
Memory system and methods of fabrication are described in which memory capacity and/or bandwidth can be expanded. In some implementations expansion may be accomplished with inclusion of custom buffer base dies, or other suitable components including network routing connecting multiple memory die stacks. In some implementations expansion may be accomplished with integration of vertically oriented memory die stacks.
Claims29
A memory system comprising:
- a routing substrate;
- a processor on a first side of the routing substrate;
- a buffer base die on the first side of the routing substrate;
- a first memory die stack on the buffer base die;
- and
- a second memory die stack on the buffer base die;
- wherein the buffer base die includes network routing connected to both the first memory die stack and the second memory die stack.
4 more elements
A memory system comprising:
- a processor;
- and
- a memory die stack operably connected with the processor, wherein the memory die stack includes a bonding surface and a plurality of memory dies oriented orthogonal to the bonding surface.
A memory system,
- a processor;
- and
- a plurality of memory die stacks mounted on the processor.
Dependencies are inferred from the claim text.