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US 2026/0096471 A1Published application
Semiconductor die cap and manufacturing method
OwnerHung-Yun Lin, Siva Gurrum +2inventors
InventorsHung-Yun Lin, Siva Gurrum, Sophia Delpak, Brooke Bernier
Life of this patent
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Abstract
An electronic device includes a semiconductor die having a side, and a cap including a first portion spaced apart from the side of the semiconductor die to define a cavity over a portion of the side of the semiconductor die, and a second portion attached to the side of the semiconductor die and extending from the side of the semiconductor die to the first portion, wherein one of the first and second portions has an opening.
Claims22
An electronic device, comprising:
- a semiconductor die having a side;
- and
- a cap including a first portion spaced apart from the side of the semiconductor die to define a cavity over a portion of the side of the semiconductor die, and a second portion attached to the side of the semiconductor die and extending from the side of the semiconductor die to the first portion, wherein one of the first and second portions has an opening.
A system, comprising:
- a circuit board having a conductive feature;
- and
- an electronic device, including:
- a conductive terminal that is soldered to the conductive feature of the circuit board;
- a semiconductor die having a side;
- and
- a cap including a first portion spaced apart from the side of the semiconductor die to define a cavity over a portion of the side of the semiconductor die, and a second portion attached to the side of the semiconductor die and extending from the side of the semiconductor die to the first portion, wherein one of the first and second portions has an opening.
4 more elements
A method of fabricating an electronic device, the method comprising:
- forming a patterned sacrificial material layer on a side of a semiconductor wafer;
- forming a cap with an opening on the patterned sacrificial material layer;
- removing the patterned sacrificial material layer from under the cap;
- separating a semiconductor die with the cap from the semiconductor wafer;
- and
- packaging the semiconductor die to form an electronic device.
3 more elements
Dependencies are inferred from the claim text.