Substrate processing apparatus and substrate processing method

A substrate processing apparatus comprising:

• a rotational holder configured to hold and rotate a substrate;
• a nozzle head including a recess provided to face a bottom surface of the substrate held in the rotational holder, and a liquid draining hole opened in the recess;
• a bottom surface ejection nozzle provided in the nozzle head, and configured to eject a processing liquid toward the bottom surface of the substrate;
• a bottom surface supply pipe connected to the bottom surface ejection nozzle;
• a heater configured to heat the processing liquid supplied to the bottom surface supply pipe;
• a flow rate regulator configured to adjust a flow rate of the processing liquid ejected from the bottom surface ejection nozzle;
• and
• a controller configured to control the flow rate regulator,
• wherein the controller includes
• a temperature controller configured to control the flow rate regulator such that the processing liquid ejected from the bottom surface ejection nozzle lands in the recess, thereby increasing a temperature of the bottom surface supply pipe, and
• a processing controller configured to, after the temperature of the bottom surface supply pipe is increased, control the flow rate regulator such that the bottom surface ejection nozzle ejects the processing liquid to a height that reaches the bottom surface of the substrate, in a state where the rotational holder holds the substrate, thereby performing a processing of the substrate.

A substrate processing method comprising:

• holding a substrate;
• rotating the substrate;
• after the holding the substrate, adjusting a flow rate of a processing liquid ejected from a bottom surface ejection nozzle connected to a bottom surface supply pipe, to eject a heated processing liquid from the bottom surface ejection nozzle to a height that does not reach a bottom surface of the substrate, thereby increasing a temperature of the bottom surface supply pipe;
• and
• after the increasing the temperature of the bottom surface supply pipe, adjusting the flow rate of the processing liquid ejected from the bottom surface ejection nozzle, to eject the processing liquid from the bottom surface ejection nozzle to a height that reaches the bottom surface of the substrate, thereby performing a processing of the substrate.