Apparatuses and methods for cleaning objects

A wafer transfer system, comprising:

• a wafer storage device configured to transport a wafer within a compartment thereof;
• an interface module that includes a transfer chamber defined by walls of the interface module, the interface module including a first interface door for receiving the wafer into the transfer chamber and a second interface door for transporting the wafer from the transfer chamber;
• a load lock module adjacent to the interface module and configured to receive the wafer from the transfer chamber of the interface module;
• a handling machine disposed within the transfer chamber of the interface module and configured to move the wafer from the wafer storage device and into the transfer chamber via the first interface door, through the transfer chamber, and into the load lock module via the second interface door;
• and
• a wafer cleaning apparatus disposed within the transfer chamber of the interface module, wherein the wafer cleaning apparatus is configured to:
• produce an ionized gas from a source of a filtered gas;
• direct the ionized gas toward a first surface of the wafer, wherein the ionized gas is configured to neutralize electrostatic charges of particles on the first surface of the wafer upon contact between the ionized gas and the first surface;
• and
• remove the ionized gas from the first surface of the wafer and thereby remove the particles from the first surface of the wafer.

A method, comprising:

• transporting a wafer within a compartment of a wafer storage device to an interface module;
• opening a first interface door of the interface module to provide access to a transfer chamber defined by walls of the interface module;
• operating a handling machine disposed within the transfer chamber of the interface module to move the wafer from the wafer storage device and into the transfer chamber via the first interface door;
• operating the handling machine to move the wafer through the transfer chamber to within proximity of a wafer cleaning apparatus disposed within the transfer chamber of the interface module;
• operating the wafer cleaning apparatus to clean the wafer by:
• produce a first flow of a first ionized gas having electrically charged gas molecules and a second flow of a second ionized gas having electrically charged gas molecules;
• contact a first surface of the wafer with the first ionized gas to neutralize electrostatic charges of particles on the first surface on a first side of the wafer upon contact between the first ionized gas and the first surface, and contact a second surface on a second side of the wafer opposite the first side with the second ionized gas to neutralize electrostatic charges of the particles on the second surface of the wafer upon contact between the second ionized gas and the second surface;
• and
• remove the particles from the first surface and the second surface of the wafer through exhaust passages;
• opening a second interface door of the interface module;
• and
• operating the handling machine to move the wafer from the transfer chamber of the interface module, through the second interface door, and into a load lock module adjacent to the interface module.