Back to results
US 2026/0096368 A1Published application
Wafer level multi form factor die singulation
AssigneeIntel Corporation
InventorsMichael J. BAKER, Vidya JAYARAM, Albert S. LOPEZ, Preston T. MYERS, Saikumar JAYARAMAN
Life of this patent
Estimating the term…
Abstract
Systems, components, and methods for wafer level semiconductor die singulation are provided. Die singulation of differently sized semiconductor dies can be accomplished without sacrificing certain semiconductor dies in favor of others.
Claims20
A system comprising:
- a plasma beam system that is capable of creating trenches in a side of a wafer wherein the trenches define boarders of semiconductor chips housed in the wafer;
- a wafer handling unit that is capable of flipping a wafer and placing it on a carrier;
- a wafer thinning unit that is capable of thinning a side of a wafer;
- and
- a computing system wherein the computing system comprises instructions for creating trenches in a first side of a wafer wherein the trenches define boarders of semiconductor chips housed in the wafer, flipping a wafer and placing it on a carrier, and for thinning a second side of the wafer.
2 more elements
A method comprising:
- creating trenches in a first side of a wafer wherein the trenches define boarders of semiconductor chips housed in the wafer;
- flipping the wafer and placing it on a carrier;
- and
- thinning a second side of the wafer wherein thinning the second side of the wafer causes the wafer to be singulated into semiconductor chips.
1 more element
A computer-readable medium on which instructions are stored in a non-transitory form, that when executed by a computer, cause a system to perform a method of:
- creating trenches in a first side of a wafer wherein the trenches define boarders of semiconductor chips housed in the wafer;
- flipping the wafer and placing it on a carrier;
- and
- thinning a second side of the wafer wherein thinning the second side of the wafer causes the wafer to be singulated into semiconductor chips.
1 more element
Dependencies are inferred from the claim text.