Heat dissipation structure able to improve heat dissipation performance of power component and electronic load device thereof

An electronic load device, comprising:

• a first heat dissipation element, comprising a first mounting side and a plurality of first protrusions projecting from the first mounting side;
• a first circuit module, comprising a first substrate disposed on the first mounting side, a plurality of first power components disposed on the first substrate and a first conductive sheet disposed over the first substrate, wherein the first substrate comprises a plurality of first through holes for the corresponding first protrusions to extend therein, at least one of the first power components is supported at the first polarity portion by the corresponding first protrusion, and a first heat conduction path is formed between each of the first power components and the first heat dissipation element by the corresponding first protrusion;
• a first connecting portion, coupled to an end of the first heat dissipation element;
• and
• a second connecting portion, coupled to an end of the first conductive sheet.