Back to results
US 2026/0096009 A1Published application
Systems and methods for cooling datacenter components
AssigneeMellanox Technologies, Ltd.
InventorsYuval Dagan, Rom Becker, Shay Zaretsky, Yuval Blayer, Itamar Bartal, Roy Kauffman, Jacov Hanuka, Nir Einati
Life of this patent
Estimating the term…
Abstract
A system is disclosed to support the efficient cooling of components in a datacenter. An example of a system may include a Printed Circuit Board (PCB), one or more cages mounted on a surface of the PCB, and a heat exchange surface integrated into the PCB. The heat exchange surface may be configured to carry a heat transfer fluid that cools the one or more cages.
Claims23
A system, comprising:
- a Printed Circuit Board (PCB);
- one or more cages mounted on a surface of the PCB;
- and
- a heat exchange surface integrated into the PCB and configured to carry a heat transfer fluid that cools the one or more cages.
1 more element
A liquid-cooled system comprising:
- a Printed Circuit Board (PCB) comprising:
- an upper surface defining a first plane;
- and
- a lower surface defining a second plane;
- one or more cages mounted on each of the upper surface and the lower surface of the PCB;
- and
- a cooling coin embedded in the PCB, the cooling coin defining a pathway positioned in between the first plane and the second plane, the pathway configured to hold a heat transfer fluid.
4 more elements
A system, comprising:
- a cooling plate, comprising:
- a first piece defining a fluid conduit;
- a second piece mountable to the first piece and configured to enclose the fluid conduit;
- and
- a plurality of ports positioned to enable fluid flow into and out of the fluid conduit.
2 more elements
Dependencies are inferred from the claim text.