3d printing of glass core edge protection in ic device packaging
AssigneeIntel Corporation
InventorsZhixin Xie, Mohamed Saber, Bohan Shan, Anastasia Arrington, Clay Arrington, Jigneshkumar Patel, Catherine Mau, Ryan Carrazzone, Haobo Chen, Wei Li, Kyle Arrington, Ziyin Lin, Dingying Xu, Hongxia Feng, Hiroki Tanaka, Brandon Marin, Jeremy Ecton, Benjamin Duong, Gang Duan, Srinivas Pietambaram, Praveen Sreeramagiri, Andrew Jimenez, Yekan Wang, Jung Kyu Han
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