A Method of Forming a Power Module Connection

Abstract

A method of forming power module connections includes removing an electrically insulative coating from each of a first section and a second section of an elongated electrically conductive body, bending the elongated electrically conductive body in one or more dimensions to form a bent segment of the elongated electrically conductive body, severing the bent segment of the elongated electrically conductive body from a bulk of the elongated electrically conductive body such that each of the first section and the second section of the elongated electrically conductive body is at an end of the severed bent segment or is between ends of the severed bent segment, securing the bent segment to a frame of a power module, attaching the frame to a substrate of the power module, attaching at least one power semiconductor die to the substrate, and attaching the first section to the substrate or a power semiconductor die.

Dependencies are inferred from the claim text.