High-power electronic package with electrically isolated heatsink

An electronic device comprising:

• a first exterior terminal at an exterior surface of the electronic device;
• a second exterior terminal at the exterior surface of the electronic device;
• an insulative layer;
• a first conductor attached to the insulative layer and electrically connected to the first exterior terminal;
• a semiconductor die having a first contact at a bottom surface and a second contact at a top surface, wherein the first contact is attached to the first conductor;
• a second conductor attached to the second contact and electrically connected to the second exterior terminal;
• and
• an encapsulant at least partially encapsulating the insulative layer, the first conductor, the semiconductor die, and the second conductor.

A method for forming an electronic device, the method comprising:

• forming a first terminal;
• forming a second terminal;
• forming an insulative layer;
• forming a first conductor and attaching the first conductor to the insulative layer and to the first terminal;
• forming a semiconductor die having a first contact at a bottom surface and a second contact at a top surface;
• attaching the first contact to the first conductor;
• forming a second conductor;
• attaching the second conductor to the second contact and to the second terminal;
• and
• forming a body of the electronic device using an encapsulant that at least partially encapsulates the insulative layer, the first conductor, the semiconductor die, and the second conductor.