Cooling Device and PCB Housing Incorporating Same
AssigneeAptiv Technologies AG
InventorsTobias Merten, Rainer Denkelmann, Naresh Yathuru
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Abstract
A cooling device for cooling electronic components mounted on a circuit board in an electronic control unit. The cooling device includes an extruded profile defining at least one channel formed longitudinally therethrough between a first end edge and a second end edge. The at least one channel is configured to receive fluid coolant. The extruded profile is configured with a first side to serve as an outer wall of the electronic control unit and a second side to serve as an interface for cooling the electronic components mounted on the circuit board.
Claims15
A cooling device for cooling a plurality of electronic components mounted on a circuit board in an electronic control unit, the cooling device comprising:
- an extruded profile defining at least one channel formed longitudinally therethrough between a first end edge and a second end edge,
- wherein the at least one channel is configured to receive fluid coolant, and
- wherein the extruded profile is configured with a first side to serve as an outer wall of the electronic control unit and a second side to serve as an interface for cooling the plurality of electronic components mounted on the circuit board.
A method of manufacturing a cooling device, the method comprising:
- extruding a profile in a longitudinal direction, wherein the profile defines at least one channel or opening therethrough in the longitudinal direction;
- and
- cutting a length of the profile to form a plate-like part.
Dependencies are inferred from the claim text.