Liquid cooled processing system with replaceable modules

Abstract

Modular processing systems are provided. In one aspect, a modular processing system includes a first electronics module including a first printed circuit board (PCB) and a first electronic component on the first PCB, a second electronics module including a second PCB and a second electronic component on the second PCB, and a cold plate arranged between the first electronics module and the second electronics module. The cold plate is configured to circulate a coolant to cool the first PCB and the second PCB. At least a portion of the cold plate is included in the first electronics module. The first electronics module is removably secured to the second electronics module.

Dependencies are inferred from the claim text.