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US 2026/0076259 A1Published application
Semiconductor device
AssigneeKioxia Corporation
InventorMasayoshi HIGASHIZONO
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a semiconductor device includes a substrate including a first surface and a recess portion in the first surface. A first semiconductor chip is disposed on a bottom surface of the recess portion. A first insulating material is filled in the recess portion and covering at least one surface of the first semiconductor chip. At least one second semiconductor chip is stacked above the first semiconductor chip.
Claims20
A semiconductor device comprising:
- a substrate including a first surface and a recess portion in the first surface;
- a first semiconductor chip disposed on a bottom surface of the recess portion;
- a first insulating material filled in the recess portion and covering at least one surface of the first semiconductor chip;
- and
- at least one second semiconductor chip stacked above the first semiconductor chip.
2 more elements
A semiconductor device comprising:
- a substrate including a first surface and a recess portion in the first surface;
- a first semiconductor chip disposed on a bottom surface of the recess portion and including a front surface substantially flush with the first surface;
- a first insulating material covering the front surface of the first semiconductor chip;
- and
- at least one second semiconductor chip stacked above the first semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.