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US 2026/0076232 A1Published application
Semiconductor structure
AssigneeMediatek Inc.
InventorsSang-Mao CHIU, Chi-Yuan CHEN, Shih-Chin LIN, Yi-Ting KUO
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Abstract
A semiconductor structure is provided. The semiconductor structure includes a substrate. The substrate includes a first core having a first top surface and a first bottom surface. First dielectric layers are disposed on the first top surface and the first bottom surface of the first core. The substrate has a first hole passing through the first core. In addition, the substrate has a second hole passing through the first core and the first dielectric layers.
Claims20
A semiconductor structure, comprising:
- a substrate, wherein the substrate comprises:
- a first core having a first top surface and a first bottom surface;
- first dielectric layers disposed on the first top surface and the first bottom surface of the first core,
- wherein the substrate has a first hole passing through the first core and a second hole passing through the first core and the first dielectric layers.
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A semiconductor structure, comprising:
- a substrate, wherein the substrate comprises:
- a core structure, wherein the core structure comprises:
- at least two cores and at least three first dielectric layers stacked on each other, wherein the at least two cores are arranged in such a way that they alternate with the at least three first dielectric layers,
- wherein the core structure has a first conductive material passing through the at least two cores and one of the at least three first dielectric layers, and a second conductive material passing through the at least two cores and the at least three first dielectric layers.
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Dependencies are inferred from the claim text.