Semiconductor package

A semiconductor package comprising:

• a package substrate including a mounting region and an edge region surrounding the mounting region;
• an interposer disposed on the mounting region of the package substrate;
• at least one semiconductor device mounted on the interposer;
• a stiffener on the edge region of the package substrate, the stiffener including a reinforcement rod that reinforces the package substrate and a plurality of adhesive receiving grooves provided in a lower edge of the reinforcement rod and exposed from both side portions of the reinforcement rod;
• and
• an adhesive member between the package substrate and the stiffener to attach the stiffener to the package substrate,
• wherein the adhesive member covers a lower surface of the reinforcement rod and is at least partially accommodated in the plurality of adhesive receiving grooves.

A semiconductor package comprising:

• a package substrate including a mounting region and an edge region surrounding the mounting region, the package substrate having first substrate recesses and second substrate recesses on the edge region and disposed along the mounting region;
• at least one semiconductor device on the mounting region of the package substrate;
• a stiffener on the edge region of the package substrate along an outer surface portion of the package substrate, the stiffener including a plurality of adhesive receiving grooves, the plurality of adhesive receiving grooves including a plurality of inner recesses and a plurality of outer recesses, the plurality of inner recesses extending from an inner surface of the stiffener into the stiffener and corresponding to the first substrate recesses, the plurality of outer recesses extending from an outer surface of the stiffener into the stiffener and corresponding to the second substrate recesses;
• and
• an adhesive member between the package substrate and the stiffener to cover one surface of the stiffener, the adhesive member being at least partially accommodated in the plurality of adhesive receiving grooves.