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US 2026/0076193 A1Published application
Power module structure, method of manufacturing the same, and cooler
AssigneeHyundai Mobis Co., Ltd.
InventorYu Cheol PARK
Life of this patent
Estimating the term…
Abstract
A power module, and a method of manufacturing the power module are provided. The power module includes a first heat sink, a substrate placed on an upper portion of the first heat sink, a semiconductor chip placed on an upper portion of the substrate, a clip placed on an upper portion of the semiconductor chip, and a second heat sink placed on an upper portion of the clip. At least one of the first heat sink and the second heat sink is formed with one or more protrusions.
Claims16
A power module, comprising:
- a first heat sink;
- a substrate placed on an upper portion of the first heat sink;
- a semiconductor chip placed on an upper portion of the substrate;
- a clip placed on an upper portion of the semiconductor chip;
- and
- a second heat sink placed on an upper portion of the clip,
- wherein at least one of the first heat sink and the second heat sink is formed with one or more protrusions.
4 more elements
A power module, comprising:
- a heat sink-integrated substrate;
- a semiconductor chip placed on an upper portion of the heat sink-integrated substrate;
- and
- a heat sink-integrated clip placed on an upper portion of the semiconductor chip,
- wherein the heat sink-integrated substrate and the heat sink-integrated clip are each formed with a plurality of protrusions.
2 more elements
A method of manufacturing a power module, the method comprising:
- placing a semiconductor chip on an upper portion of a heat sink-integrated substrate;
- placing a heat sink-integrated clip on an upper portion of the semiconductor chip;
- and
- bonding one side of the heat sink-integrated clip to a lead to establish electrical connection therebetween,
- wherein the heat sink-integrated substrate and the heat sink-integrated clip each include one or more protrusions.
2 more elements
Dependencies are inferred from the claim text.