US 2026/0076182 A1 · VARIED SUBSTRATE THICKNESS FOR THERMAL MANAGEMENT

Abstract

Integrated circuit (IC) structures with varied substrate thicknesses may enable targeted cooling in regions that are expected to generate more heat, while not excessively cooling regions that are expected to generate less heat. In one example, an IC structure includes a device region over a substrate, where the device region includes a first region (e.g., a region with high performance devices) and a second region coplanar with the first region (e.g., where the second region includes lower voltage transistors and/or other circuitry expect to generate less heat). In one example, the thickness of the substrate below the first region may be smaller than the thickness of the substate below the second region. In one example, a thermally conductive material over the second side of the substrate may be thicker below the first region, and thinner (or absent) below the second region.

Claims20

Dependent claims

An integrated circuit (IC) structure, comprising:

a substrate, wherein the substrate has a first side and a second side opposite the first side;
a device region over the first side of the substrate, wherein the device region comprises a first region and a second region coplanar with the first region, and wherein:
a first portion of the substrate below the first region has a first thickness, wherein the first thickness is a first dimension of the substrate in a first plane substantially orthogonal to the substrate, and
a second portion of the substrate below the second region has a second thickness, wherein the second thickness is a second dimension of the substrate in a second plane substantially orthogonal to the substrate, and the second thickness is greater than the first thickness;
and
a thermally conductive material over the second side of the substrate in the first plane.

3 more elements

Dependencies are inferred from the claim text.

Varied substrate thickness for thermal management

Life of this patent

Varied substrate thickness for thermal management

Life of this patent

Abstract

Claims20