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US 2026/0075779 A1Published application
Cooling apparatus for power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsSang Hun Lee, Hyong Joon Park, Se Heun Kwon
Life of this patent
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Abstract
A cooling apparatus for a power module includes a manifold cover including an internal space in which a power module is installed, an inlet providing a passage for cooling fluid to flow into the internal space, and an outlet providing a passage for the cooling fluid to be discharged from the internal space and a valve member including a bimetal switch disposed on the manifold cover so that a flow rate of the cooling fluid is adjusted according to a temperature.
Claims13
A cooling apparatus for a power module, the cooling apparatus comprising:
- a manifold cover including an internal space having a power module, an inlet providing a passage for cooling fluid to flow into the internal space, and an outlet providing a passage for the cooling fluid to be discharged from the internal space;
- and
- a valve member including a bimetal switch disposed on the manifold cover configured to adjust a flow rate of the cooling fluid according to a temperature.
Dependencies are inferred from the claim text.