Method of fabricating semiconductor packages to mitigate voids therein

A semiconductor package comprising:

• a wafer;
• a chip-on-wafer (CoW) arrangement on the wafer;
• and
• a molding underfill (MUF) around the CoW arrangement, the MUF comprising a compound formed from a non-conductive film (NCF) and a molding compound.

A method comprising:

• positioning a non-conductive film (NCF) over a chip-on-wafer (CoW) arrangement located on a substrate, the NCF positioned on an end of the CoW arrangement opposite the substrate;
• dispensing, after positioning the film over the CoW arrangement, a liquid-type molding compound into a chamber of a mold of a compression molding apparatus while the CoW arrangement and substrate are positioned therein;
• and
• compressing the liquid-type molding compound and the NCF to form a molding underfill (MUF) around the CoW arrangement.