Methods to quickly adjust the temperature of at least one processing liquid used to process a semiconductor substrate in a wet process

A method for adjusting a temperature of at least one processing liquid used to process a semiconductor substrate in a wet process, the method comprising:

• providing the at least one processing liquid at a first temperature at or near room temperature;
• dispensing the at least one processing liquid onto a surface of the semiconductor substrate;
• adjusting a temperature of the at least one processing liquid during the wet process, wherein the temperature of the at least one processing liquid is adjusted at or near a location at which the at least one processing liquid is dispensed onto the surface of the semiconductor substrate, wherein said adjusting the temperature comprises:
• increasing the temperature of the at least one processing liquid to a second temperature, which is greater than the first temperature, during a first time period;
• and
• decreasing the temperature of the at least one processing liquid to a third temperature, which is less than the first temperature or the second temperature, during a second time period.