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US 2026/0040539 A1Published application
Semiconductor device structure including fuse structure embedded in substrate
AssigneeNanya Technology Corporation
InventorHSIH-YANG CHIU
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Abstract
A semiconductor device structure and a method of manufacturing the same are provided. The semiconductor device structure includes a substrate, a fuse structure, and a first word line. The fuse structure includes a fuse electrode disposed within the substrate. The first word line is electrically coupled to the fuse structure. The first word line is disposed within the substrate and spaced apart from the fuse electrode of the fuse structure. The fuse electrode has a lateral surface protruding toward the first word line.
Claims9
A semiconductor device structure, comprising:
- a substrate;
- a fuse structure comprising a fuse electrode disposed within the substrate;
- and
- a first word line electrically coupled to the fuse structure,
- wherein a horizontal distance between the fuse electrode of the fuse structure and the first word line changes along a direction far away from the substrate.
2 more elements
Dependencies are inferred from the claim text.