Component built-in wiring board and method for manufacturing component built-in wiring board

A method for manufacturing a component built-in wiring board, comprising:

• preparing a connecting component comprising a plurality of electronic components including a first component and a second component;
• forming an opening part in a core substrate extending from a first surface of the core substrate to a second surface of the core substrate on an opposite side with respect to the first surface of the core substrate;
• inserting the connecting component into the opening part of the core substrate such that the first component has terminals on a first surface side of the core substrate and the second component has terminals on a second surface side of the core substrate;
• forming a filling resin part in the opening part of the core substrate such that the filling resin part fills a space formed between the core substrate and the connecting component in the opening part of the core substrate;
• laminating a first build-up part on the first surface side of the core substrate such that the first build-up part covers the opening part of the core substrate on the first surface side of the core substrate;
• and
• laminating a second build-up part on the second surface side of the core substrate on an opposite side with respect to the first side such that the second build-up part covers the opening part of the core substrate on the second surface side of the core substrate,
• wherein the preparing the connecting component includes forming a molding resin part positioning the electronic components spaced apart from each other therein, and forming a plurality of penetrating conductors in the molding resin part such that the penetrating conductors are formed on the second surface side of the core substrate and connected to the terminals of the second component on the second surface side of the core substrate.