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US 2026/0018449 A1Published application
Substrate processing apparatus
AssigneeNissin Ion Equipment Co., Ltd.
InventorsShinsuke INOUE, Takayuki MURAYAMA, Yuya HIRAI
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus includes an electrostatic chuck that supports a substrate, a detachment device that releases the substrate that is supported by the electrostatic chuck, from the electrostatic chuck, and a control device that determines a load on the detachment device and applies a release voltage to the electrostatic chuck, based on the load.
Claims20
A substrate processing apparatus comprising:
- an electrostatic chuck that is configured to support a substrate;
- a detachment device that is configured to release the substrate that is supported by the electrostatic chuck, from the electrostatic chuck;
- and
- a control device that determines a load on the detachment device and applies a release voltage to the electrostatic chuck, based on the load.
1 more element
A substrate processing apparatus comprising:
- an electrostatic chuck that is configured to support a substrate;
- a control device that applies a release voltage to the electrostatic chuck;
- and
- a drive source that is configured to rotate the electrostatic chuck to release the substrate that is supported by the electrostatic chuck, from the electrostatic chuck,
- wherein the control device determines a load on the drive source based on an output signal from the drive source, determines whether the load is greater than a reference value, and when the load is greater than the reference value, increases the release voltage.
2 more elements
A substrate processing apparatus comprising:
- a platen comprising an electrostatic chuck that is configured to support a substrate;
- a drive source that is configured to move the platen,
- a control device that applies a release voltage to the electrostatic chuck and controls the drive source to move the platen to physically release the substrate that is supported by the electrostatic chuck, from the electrostatic chuck;
- and
- wherein the control device determines a load caused by a movement of the platen to physically release the substrate, determines whether the load is greater than a reference value, and when the load is greater than the reference value, increases the release voltage.
2 more elements
Dependencies are inferred from the claim text.