Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsRyohei YONEDA, Tatsuya YAMAGUCHI
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Abstract
A substrate processing apparatus cleans a substrate. The substrate processing apparatus includes a processing container, a stage, a top board, a lifting/lowering mechanism, and a guide mechanism. The stage is located inside the processing container and configured to support the substrate. The top board faces the stage. The lifting/lowering mechanism is configured to lift and lower the substrate. The guide mechanism is located on the top board and configured to bring the substrate into contact therewith.
Claims12
A substrate processing apparatus that cleans a substrate, the substrate processing apparatus, comprising:
- a processing container;
- a stage located inside the processing container and configured to support the substrate;
- a top board facing the stage;
- a lifting/lowering mechanism configured to lift and lower the substrate;
- and
- a guide mechanism located on the top board and configured to bring the substrate into contact therewith.
A substrate processing method executed by a substrate processing apparatus that includes
- a processing container including a radical supply port,
- a stage located inside the processing container and configured to support a substrate,
- a top board including a facing surface facing the stage, and a gas hole located inside the radical supply port and penetrating through the facing surface,
- a lifting/lowering mechanism configured to lift and lower the substrate, and
- a guide mechanism located on the top board and configured to bring the substrate into contact therewith, the substrate processing method comprising:
- (A) preparing the substrate on the stage;
- (B) preventing a radical of etching gas from flowing into a center part of the substrate, by supplying inert gas from the gas hole;
- (C) lifting and lowering the substrate;
- (D) determining contact between the substrate and the guide mechanism;
- (E) stopping lifting or lowering the substrate, based on the determined result;
- and
- (F) cleaning an outer peripheral part of the substrate, by supplying the radical of etching gas from the radical supply port.
Dependencies are inferred from the claim text.