Localized thinned board for bottom side component integration

An apparatus, comprising:

• a first substrate;
• a second substrate coupled to the first substrate by an interconnect, wherein a standoff height is provided between the first substrate and the second substrate;
• a depression with rounded corners in the first substrate;
• and
• a component between the first substrate and the second substrate, wherein a thickness of the component is greater than the standoff height, and wherein the component is within a footprint of the depression.

An apparatus, comprising:

• a substrate with a first region and a second region, wherein the substrate comprises a dielectric material;
• electrically conductive routing within the substrate, wherein the electrically conductive routing within the first region has a first proportion of metal area relative to the dielectric material area, and the electrically conductive routing within the second region has a second proportion of metal area relative to the dielectric material area, and wherein the second proportion is lower than the first proportion;
• and
• wherein the first region of the substrate has a first thickness, and the second region of the substrate has a second thickness that is smaller than the first thickness.