Substrate support unit and heat treatment device including same

A heat treatment device, comprising:

• a heat treatment chamber configured to provide a heat treatment space for a substrate;
• a substrate support unit disposed in the heat treatment space of the heat treatment chamber, and comprising a substrate support configured to support a substrate, a plurality of pin assemblies spaced apart from each other at an outer portion of the substrate support and each of which comprises a lift pin configured to lift and lower the substrate, a guide tip located outside the lift pin and configured to guide the substrate to be prevented from deviating from its position, and a body on which the lift pin and the guide tip are arranged to correspond to each other, and a pin lifting means configured to lift and lower the bodies of the plurality of pin assemblies to adjust a height of the substrate;
• a plurality of pin lifting means configured to lift a plurality of pin assembly groups, respectively, each of the plurality of pin assembly groups being composed of at least one selected from the plurality of pin assemblies;
• a substrate height controller configured to control each of the plurality of pin lifting means to adjust a lifting height of each of the plurality of pin assembly groups and configured to adjust inclination of the substrate by individually controlling the plurality of pin lifting means so that the plurality of pin assembly groups have different lifting heights;
• a heat source unit configured to divide a portion corresponding to the substrate into a plurality of heat source regions, and comprising a plurality of lamps arranged in each of the plurality of heat source regions by adjusting arrangement density of the plurality of lamps according to the number of the plurality of lamps, and a heat source controller configured to control operation of the plurality of lamps for each of the plurality of heat source regions;
• a side wall refrigerant flow path formed at a wall of the heat treatment chamber;
• a bottom refrigerant flow path formed in the substrate support of the substrate support unit;
• a refrigerant supplier configured to supply a refrigerant to the side wall refrigerant flow path and the bottom refrigerant flow path;
• and
• a gas supply unit configured to supply an environment-forming gas or a purge gas to the heat treatment space of the heat treatment chamber,
• wherein the substrate support unit adjusts a flow of the environment-forming gas or the purge gas from a first side of the substrate that is relatively high to a second side of the substrate that is relatively low through adjustment of inclination of the substrate.