System and process for post-chemical mechanical polishing cleaning

A substrate carrier comprising:

• a carrier body;
• at least one lift handle feature incorporated in an upper portion of the carrier body;
• a substrate holder at a bottom inner surface of the carrier body configured to hold a substrate;
• and
• a protrusion extending from an outer surface of the carrier body.

A system for cleaning a substrate after chemical mechanical polishing, the system comprising:

• an input tank;
• a cleaning tank comprising a transport system;
• a substrate carrier;
• a rinse tank;
• an output tank;
• one or more wet robots;
• a substrate carrier robot system;
• and
• a controller configured to cause the system to:
• insert a substrate into a substrate carrier in the input tank using the one or more wet robots;
• transfer the substrate carrier from the input tank to the cleaning tank using the substrate carrier robot system;
• transport the substrate in the substrate carrier through the cleaning tank for a predetermined period using the transport system;
• remove the substrate carrier from the cleaning tank using the substrate carrier robot system;
• insert the substrate carrier into the rinse tank using the substrate carrier robot system;
• rinse the substrate in the substrate carrier in the rinse tank;
• remove the substrate carrier from the rinse tank using the substrate carrier robot system;
• place the substrate carrier into the output tank using the substrate carrier robot system;
• and
• remove the substrate from the substrate carrier using the substrate carrier robot system.