Barrier layer removal device and barrier layer removal method

A barrier layer removal device, comprising:

• a frame mounted with a tape to which a wafer is attached, wherein the wafer includes a barrier layer disposed on a first surface;
• a support on which the wafer, attached to the tape, is disposed;
• a frame cover disposed above the frame, wherein the frame cover fixes the wafer on the support by pressing an edge region of the first surface of the wafer;
• a plurality of contact pins respectively pressing the edge regions of the first surface of the wafer together with the frame cover;
• and
• a nozzle for spraying an etchant on the barrier layer of the wafer.

A barrier layer removal method, comprising:

• mounting a tape on a frame;
• attaching a wafer to the tape, wherein the wafer includes a barrier layer;
• disposing the wafer, which is attached to the tape, on a support;
• fixing the wafer on the support by pressing a surface of the wafer;
• and
• removing the barrier layer by spraying an etchant on the barrier layer.