Chip manufacturing method

A chip manufacturing method for manufacturing a plurality of chips by dividing a substrate having a top surface provided with a film, along a planned dividing line of a predetermined width, the chip manufacturing method comprising:

• a processed groove forming step of forming a processed groove by removing a part of the film along the planned dividing line;
• and
• a dividing step of forming the plurality of chips by dividing the substrate along a bottom of the processed groove after the processed groove forming step,
• the processed groove forming step including
• a first processed groove forming step of forming a first processed groove having a first width in a direction of the width by applying a first laser beam along the planned dividing line, and
• a second processed groove forming step of forming a second processed groove having a second width different from the first width in the direction of the width by applying a second laser beam along the planned dividing line after the first processed groove forming step.