Substrate processing apparatus and a substrate processing method

A substrate processing method that disposes a substrate into a treatment space provided in a supercritical chamber and treats the substrates by supplying treatment fluid in a supercritical state to the treatment space, the method comprising:

• a loading step of loading a substrate into the treatment space;
• a discharge step of discharging an atmosphere in the treatment space;
• a pressurizing step of pressurizing the treatment space by supplying treatment fluid to the treatment space;
• a treatment step of treating the substrate in the treatment space using a fluid supplied to the treatment space;
• and
• a depressurizing step of exhausting the fluid from the treatment space,
• wherein a common pipe is connected to the treatment space,
• the common pipe is connected with a supply line supplying the treatment fluid to the treatment space and an exhaust line exhausting the atmosphere of the treatment space, and
• discharge and exhaust of the treatment space are performed through the common pipe in the discharge step and the depressurizing step.