Cleaning brush for semiconductor device and cleaning module and cmp equipment and post-cmp cleaning method

Abstract

The present disclosure relates to a cleaning brush for a semiconductor device, a cleaning module for a semiconductor device, a chemical mechanical polishing (CMP) equipment, and a post-CMP cleaning method. An example cleaning brush for a semiconductor device includes a polymer with a stimulus-responsive ligand. An example cleaning module for a semiconductor device includes the cleaning brush. An example chemical mechanical polishing equipment includes the cleaning module. An example post-CMP cleaning method uses the cleaning brush, the cleaning module, or the chemical mechanical polishing equipment.

Dependencies are inferred from the claim text.