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US 2025/0159849 A1Published application
Power module temperature management device
AssigneesHyundai Motor Company, Kia Corporation
InventorTae Hwa KIM
Life of this patent
Estimating the term…
Abstract
Introduced is a power module temperature management device including a flow path including a first section thermally connected to the power module and a second section connected in series to the first section for a coolant to flow from the second section to the first section, and a coolant cooler thermally connected to the second section of the flow path and cooling the coolant flowing into the second section according to a predetermined condition.
Claims19
An apparatus for managing temperature of a power module, the apparatus comprising:
- a flow path including a first section thermally connected to the power module and a second section connected in series to the first section for a coolant to flow from the second section to the first section through the first section and the second section;
- and
- a coolant cooler thermally connected to the second section of the flow path and cooling the coolant flowing into the second section according to a predetermined condition.
Dependencies are inferred from the claim text.